High Power Switching on Wireless Power Transfer: Thermal Modeling and Analysis of IGBT Modules Using ANSYS Icepak

 

Descripción y objetivos


Attend this webinar and discover how ANSYS simulations can be less costly and time consuming than standard experimental methods used to validate power switching devices, which do not give detailed information about different layers of IGBT modules. Learn how ANSYS Icepak simulations enable thermal modeling and analysis of IGBT modules under various conditions to address concerns about cost, reliability and performance.

Date:
September 16, 2015
Time:
11 AM EDT, 3 PM GMT
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Contact:
convergence@ansys.com



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